Sapphire Wafer

Sapphire is a material of a unique combination of physical, chemical and optical properties, which make it resistant to high temperature, thermal shock, water and sand erosion, and scratching. It is a superior window material for many IR applications from 3µm to 5µm. C-plane sapphire substrates are widely used to grow III-V and II-VI compounds such as GaN for blue LED and laser diodes, while R-plane sapphire substrates are used for the hetero-epitaxial deposition of silicon for microelectronic IC applications.

Features: 

  • All orientations are available, custom orientation is welcome    
  • Wafer size from 2 to 6 inches are available for all types
  • Thin wafer down to 250um for 2 inch, 300um for 4 inch and 300um for 6 inch

Specification: 

Orientation

R-plane, C-plane, A-plane, M-plane or a specified orientation

Orientation Tolerance

± 0.3°

Diameter

2 inches, 3 inches, 4 inches, 6 inches, 8 inches or others

Diameter Tolerance

0.1mm for 2 inches, 0.2mm for 3 inches, 0.3mm for 4 inches, 0.5mm for 6 inches

Thickness

0.25mm, 0.33mm, 0.43mm, 0.65mm, 1mm or others;

Thickness Tolerance

25μm

Primary Flat Length

16.0±1.0mm for 2 inches, 22.0±1.0mm for 3 inches, 30.0±1.5mm for 4 inches, 47.5±2.0mm for 6 inches

Primary Flat Orientation

A-plane (1 1-2 0 ) ± 0.2°;  C-plane (0 0-0 1 ) ± 0.2°,  Projected C-Axis 45 +/- 2°

TTV

≤10µm for 2 inches,  ≤15µm for 3 inches,  ≤20µm for 4 inches,  ≤25µm for 6 inches

BOW

≤10µm for 2 inches,  ≤15µm for 3 inches,  ≤20µm for 4 inches,  ≤25µm for 6 inches

Front Surface

Epi-Polished (Ra< 0.3nm for C-plane, 0.5nm for other orientations)

Back Surface

Fine ground (Ra=0.6μm~1.4μm) or Epi-polished

Packaging

Packaged in a class 100 clean room environment

 

Applications: 

  • Growth substrate for III-V and II-VI compounds   
  • Electronics and optoelectronics
  • IR applications
  • Silicon On Sapphire Integrated Circuit(SOS)
  • Radio Frequency Integrated Circuit(RFIC)

 

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Key Features

  • All orientations are available
  • Wafer size from 2 to 6 inches are available for all types
  • Thin wafer down to 250um for 2 inch
  • 300 um for 4 inch
  • 300 um for 6 inch
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