G6E-HTSG is a two-component electrically conductive adhesive that is engineered to combine bond strength and high electrical conductivity. The epoxy composite is based on the mixture of graphene and silver particles. The graphene nanoparticles increase the electrical conductivity of the epoxy and enhance the strength of the material and prevent the formation of cracks, improving the durability of the bond. This is especially important for bonding dissimilar materials subjected to the temperature variations and shocks.
The G6E-HTSG resin works up to 316°C (600 F) and demonstrates excellent adhesion to a variety of materials including plastics, metals, glass and ceramics.
. TWO COMPONENT SYSTEM: Part A – smooth thixotropic silver paste, Part B – smooth thixotropic silver paste.
. THE MIX RATIO: Mix 100 (Part A) to 50 (Part B) by weight.
. CURING INSTRUCTIONS: Best results are obtained when the product is cured at one of the following schedules: 4 hours @ 150°C (302 F). For optimum properties, post cure for 1-2 hours @ 180°C (350 F).
. COLOR: Silver
. POT LIFE: 4 hours
. GLASS TRANSITION TEMPERATURE: 129°C
. MIXED VISCOSITY: 290-310 Pa·sec at 25°C/77 F
. HARDNESS, SHORE: >80D
. VOLUME RESISTIVITY: ~ 0.0005 Ω·cm