G6E-RTSG epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection of conductive components or materials. This epoxy is also formulated with proprietary nanomaterials and fillers to provide low electrical resistivity.
G6E-RTSG epoxy also incorporates a proprietary graphene additive to enhance the crack resistance of the epoxy adhesive. G6E-RTSG epoxy has outstanding electrical conductivity and is ideal for applications involving manufacture or repair of conductive and temperature sensitive components. Uses for G6E-RTSG epoxy include cold solder replacement applications, printed circuit board, EMI / RFI shielding assembly/repair, etc.
. TWO COMPONENT SYSTEM: Part A – smooth thixotropic silver paste, Part B – smooth thixotropic silver paste
. THE MIX RATIO: Mix 100 (Part A) to 20 (Part B) by weight.
. CURING INSTRUCTIONS: Best results are obtained when the product is cured at one of the following schedules: 4 hours @ 25°C (77 F), 30 mins @ 60°C (140 F) or 10 mins @ 150 °C (302 F)
. COLOR: Silver
. POT LIFE: 15 mins
. GLASS TRANSITION TEMPERATURE: 96°C/205 F cured at 60°C/140 F
. MIXED VISCOSITY: 440 Pa·sec at 25°C/77 F, 93 Pa·sec at 50°C/122 F
. HARDNESS, SHORE: >85D
. VOLUME RESISTIVITY: 0.003 Ω·cm at RT and 0.0001 Ω·cm at 150°C/302 F”